LOW TEMPERATURE CURABLE POLYIMIDE RESIN AND METHOD OF PREPARING THE SAME

摘要

PURPOSE: A polyimide resin with is provide to make hardening at low temperature possible, and to minimize the damage of device according to high temperature process, thereby using as more various electronic material like plastic substrate. CONSTITUTION: A manufacturing method of polyimide resin comprises a step of polymerizing polyimide resin by using low boiling point solvent of which boiling point is 130-180°C. The use amount of the low boiling point solvent is 20-2000 parts by weight on the basis of 100.0 parts by weight monomer for manufacturing polyimide resin. The glass transition temperature is 150-400°C. The average molecular weight is 1,000-100,000.