| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a circuit board and a semiconductor device, which allow the suppression of the occurrence of warping and the achievement of a good productivity, a method of manufacturing the circuit board, and a method of manufacturing the semiconductor device. <P>SOLUTION: A resin layer 3 including a compound having a flux function covers a second insulative layer 23 and is provided on a solder layer 26. When an average linear expansion coefficient of a first insulative layer 21 in a direction in a substrate plane at a temperature of 25°C to a glass transition point is called an average linear expansion coefficient (A), an average linear expansion coefficient of the second insulative layer 23 in the direction in the substrate plane at a temperature of 25°C to the glass transition point is called an average linear expansion coefficient (B), and an average linear expansion coefficient of a third insulative layer 25 in the direction in the substrate plane at a temperature of 25°C to the glass transition point is called an average linear expansion coefficient (C), the difference between (B) and (C) is 0 to 3 ppm/°C inclusive, and (B) and (C) are larger than (A). <P>COPYRIGHT: (C)2012,JPO&INPIT |
