| 摘要 |
<P>PROBLEM TO BE SOLVED: To easily perform from the high speed machining of a thin plate to the machining of a thick plate, without changing the focal distance of a condensing lens 27 and the beam diameter of a laser beam LB. <P>SOLUTION: The solid-state laser machining device includes: a solid-state laser oscillator for generating a laser beam LB; a feeding fiber 12 for transmitting the laser beam LB which is generated with the solid-state laser oscillator; a beam mode transforming unit 14, through which the laser beam LB transmitted with the feeding fiber 12 passes; and a laser machining unit for condensing the laser beam LB, having passed through the beam mode transforming unit 14, and emitting it to a workpiece W. The beam mode transforming unit 14 has: one or more process fibers 33a, 33b having a core diameter which is different from a core diameter of the feeding fiber 12; and a selecting part 38 which selects whether or not to transmit the laser beam LB to one or more process fibers 33a, 33b. <P>COPYRIGHT: (C)2012,JPO&INPIT |
