| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a detector capable of preventing a junction failure of a bump and an insulation failure caused by the difference of coefficient of thermal expansion while ensuring its compact size and low cost, and to provide a light-receiving element array, a method for manufacturing them and an optical sensor device. <P>SOLUTION: A light-receiving array 50 and a CMOS 70 are joined via bumps 9, 39, and a surface opposed to a mate side of at least either of the light-receiving array and a read-out circuit has a convex curved surface. The joined bump positioned in an outer periphery range K of a region where joined bumps 9, 39 are arranged, has a wider diameter and a lower height than that of the joined bump positioned in a central range C. <P>COPYRIGHT: (C)2012,JPO&INPIT |
