| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress manufacturing cost such as material cost and processing cost of an electronic fixture such as a lighting device 199 or the like, downsize the device, and enhance manufacturing efficiency of the device while ensuring a desired heat dissipation effect against it. <P>SOLUTION: In the electronic fixture in which the lighting device 199 to light on a halogen lamp or an incandescent lamp is built in a case 200, nearly L-shaped metal heat-dissipating fins 300 are mounted on electronic parts (for example, electronic part 102 and electronic 104) mounted on an electronic transformer substrate 100 so that heat-dissipating faces 320 become a side of the top face 202 or the bottom face 201 of the case 200. Then, elastic pads 330 for heat transmission are mounted on the heat radiation faces 320 of the heat radiation fins 300. By this, the pads 330 are contacted with the top face 202 or the bottom face 201 of the case 200 with a moderate stress, and heat generated in the electronic parts can be dissipated by the case 200. <P>COPYRIGHT: (C)2012,JPO&INPIT |
