发明名称 IC TAG AND IC CHIP BREAKAGE PREVENTION METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide an IC tag capable of further reducing IC chip breakage, and an IC chip breakage prevention method. <P>SOLUTION: An IC tag 1 comprises: a support 11; an IC chip 12 connected to an antenna circuit of the support 11; and an adhesive material. A reinforcement material 40 having an aperture 41 is attached on a surface 201 (outermost surface) on the opposite side to a surface where the adhesive material 32 of the support 11 is laminated, so that the IC chip 12 is arranged within the aperture 41 from a planar view of the IC tag 1. At a cross section perpendicular to a surface of the support 11, the formulae, (1)L&ge;1.50&times;T1 and (2)T2&ge;0.35&times;T1, are satisfied when setting a distance between an aperture inner edge 411 of the reinforcement material 40 and an outer edge 121 of the IC chip 12 as L[mm], setting a thickness from a surface (undersurface 122) on the side of the adhesive material 32 of the IC chip 12 to the surface 201 as T1[mm] and setting a thickness of the reinforcement material 40 as T2[mm]. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012053570(A) 申请公布日期 2012.03.15
申请号 JP20100194297 申请日期 2010.08.31
申请人 LINTEC CORP 发明人 MATSUSHITA KAORI;KATAKURA KATSUMI;OKAMOTO NAOYA;YAMAKAGE MASATERU
分类号 G06K19/077;G06K19/07 主分类号 G06K19/077
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