| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electro-optic device manufacturing method capable of bonding a dust-proof substrate, which is larger than an electro-optical panel as viewed in a plan view, to the electro-optical panel with high positional accuracy. <P>SOLUTION: An electro-optic device manufacturing method comprises the steps of: mounting a jig frame (700) on a mounting stand such that first and second panel reference surfaces (711 and 712) are oblique to a horizontal surface; accommodating an electro-optical panel (500), an emission-side dust-proof substrate (410) and an incident-side dust-proof substrate (420) in the jig frame (700) such that first and second panel side surfaces (501 and 502) are individually in contact with the first and second panel reference surfaces (711 and 712), first and second emission-side dust-proof substrates side surfaces (411 and 412) are individually in contact with first and second emission-side reference surfaces (712 and 722) and first and second incident-side dust-proof substrates side surfaces (421 and 422) are individually in contact with first and second incident-side reference surfaces (713 and 723); and fitting a jig hook (800) to the jig frame (700). <P>COPYRIGHT: (C)2012,JPO&INPIT |
