发明名称 COMPONENT MOUNTING METHOD AND COMPONENT MOUNTING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a component mounting apparatus which sucks and holds a component by a nozzle at an accurate position for installation. <P>SOLUTION: A component mounting method includes bringing apical surfaces 124 of a plurality of nozzles 121 arranged in a matrix in a head 102 and having suction holes 123 with inner negative pressure into contact with components to suck and hold a component 200, and mounting the held component 200 on a substrate 300. Imaging means 106 images a two-dimensional region including the apical surface 124 of the nozzle 121 that does not hold the component 200, and a dark color region 212 corresponding to an aperture 125 of the suction hole 123 disposed on the apical surface 124 is identified by image processing based on acquired image data 400. And based on the identified dark color region 212, a suction position B(121B) of the nozzle 121 is derived as a positional standard used when the nozzle 121 sucks a component. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012059735(A) 申请公布日期 2012.03.22
申请号 JP20100198367 申请日期 2010.09.03
申请人 PANASONIC CORP 发明人 IKEDA MASANORI;TOMOMATSU MICHINORI;FURUICHI SATOSHI;TANIGUCHI MASAHIRO
分类号 H05K13/04 主分类号 H05K13/04
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