发明名称 |
STRUCTURE AND METHOD FOR CONNECTING WIRING BOARD |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a structure and a method for connecting a wiring board that can improve the connection strength between a connected object and the wiring board. <P>SOLUTION: In a structure for connecting a wiring board, an input contact of a piezoelectric actuator and a board-side contact of a COF 50 (Chip On Film) of a printer are electrically connected by a conductive part made of conductive resin containing metallic material and thermosetting resin. And the piezoelectric actuator and the COF are mechanically connected to each other via a reinforcement part 62 in addition to the conductive part. The reinforcement part 62 is located at a position different from the conductive part in the COF 50 and arranged at a position straddling a surface of a solder resist 54 and a surface of a flexible substrate 52. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012069548(A) |
申请公布日期 |
2012.04.05 |
申请号 |
JP20100210420 |
申请日期 |
2010.09.21 |
申请人 |
BROTHER IND LTD |
发明人 |
KUBO TOMOYUKI;SHINKAI YUJI |
分类号 |
H05K1/14;B41J2/045;B41J2/055;B41J2/16;H05K3/36 |
主分类号 |
H05K1/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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