| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which enhances the lead-out performance of wiring, suppresses a possibility of causing electric problems such as a short-circuit between the wiring, and which is intended to save the area where the wiring is formed. <P>SOLUTION: Plural first wiring 3 is juxtaposed in a predetermined layer on a substrate 4 provided in the semiconductor device 1. Each of the first wiring 3 is formed, extending long as directing from one side to the other side along a direction of arranging the first wiring 3, or is formed with a reduced condition. Along with that, each of the first wiring 3 is disposed at a position where adjacent one ends 3a thereof are shifted to each other in a direction perpendicular to an arranged direction. <P>COPYRIGHT: (C)2012,JPO&INPIT |
