THE PRINTED CIRCUIT BOARD AND THE METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A printed circuit board and a manufacturing method thereof are provided to improve heat dissipation by forming a buried via in an insulation layer of a multilayer printed circuit board. CONSTITUTION: At least one via passes through a core insulation layer. An inner circuit layer(111) is buried in the core insulation layer. An external circuit layer(131,135,145) is formed on the upper or lower side of the core insulation layer. The center of the via has a first width. An adhesion surface with the surface of the core insulation layer has a second width.