发明名称 GAS-TIGHT PACKAGE
摘要 The encapsulation lid (1) comprises at least two glass layers of different compositions, a first layer (2) called the bottom layer, which is continuous, and at least a second layer (3, 6), which is discontinuous and designed so as to define cavities (4, 5) or anfractuosities in this lid. Preferably, the glass layers other than the first layer are preferably formed from low-melting-point frits, thereby allowing such lids to be manufactured economically, without recourse to glass machining.
申请公布号 KR101157106(B1) 申请公布日期 2012.06.22
申请号 KR20050048918 申请日期 2005.06.08
申请人 发明人
分类号 H01L23/12;H01L51/50;H01L51/52;H05B33/04 主分类号 H01L23/12
代理机构 代理人
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