LED MODULE DEVICE AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To improve heat dissipation characteristics of an LED module device.

SOLUTION: A wiring board comprises a glass epoxy substrate where wiring is formed. An LED package substrate is in a laminated configuration for which metal foil is attached holding an insulating layer comprising a polyimide resin having a film thickness in the range of 5 μm to 40 μm therebetween onto a metal plate bent to form a planar bottom part and wall parts respectively rising from both sides of the bottom part end. An LED package is constituted by mounting an LED chip on an upper surface of the planar bottom part and filling a transparent resin. The planar bottom part back surface of the LED package is fixed to a heat dissipation body, a wall upper part of the LED package is attached to the glass epoxy substrate, and an external connection electrode is connected with the wiring of the glass epoxy substrate on the attached part.

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