| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide flip chip mounting capable of suppressing reduction of filler density of a liquid sealant after application of the liquid sealant and before curing in a part of an electrode and/or wiring without bonding to a solder bump. <P>SOLUTION: A mounting method of an electronic component comprises the steps of; (A) bonding an electronic component with solder bumps, and a substrate including electrodes and/or wiring for bonding to the solder bumps, and electrodes and/or wiring without bonding to the solder bumps and with an exposed metal different from solder via the solder bumps; (B) applying a gap between the electronic component and the substrate with a liquid sealant containing filler and curing the liquid sealant; and covering the surfaces of the electrodes and/or wiring provided on the substrate, without bonding to the solder bumps, and with the exposed metal different from solder by an organic material before the (B) step. <P>COPYRIGHT: (C)2012,JPO&INPIT |
