发明名称 RESIN PEELING DEVICE AND GRINDING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a resin peeling device capable of easily peeling a cured resin covering one surface of a work. <P>SOLUTION: In the resin peeling device which peels off a cured resin film R sticking to the surface of a disc-like work W from the work W, the cured resin film R is sticking to the surface of the work W while projecting from the whole circumference at the edge of the work W. The resin peeling device has a holding part 10a in which a holding surface 10h for suction holding the rear surface of the work W is formed, and an external force imparting part 10b for imparting an external force from the rear surface toward the surface of the work W at a place of the cured resin film R sticking to the work W held on the holding part 10a and projecting from the edge of the work W. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012151275(A) 申请公布日期 2012.08.09
申请号 JP20110008790 申请日期 2011.01.19
申请人 DISCO ABRASIVE SYST LTD 发明人 KUWANA KAZUTAKA;GENOEN JIRO
分类号 H01L21/304;B24B7/00;H01L21/683 主分类号 H01L21/304
代理机构 代理人
主权项
地址