| 发明名称 |
APPARATUS AND METHOD FOR MANUFACTURING PRINTED PLATE BOARD |
| 摘要 |
<p>PURPOSE: A device and method for manufacturing a printed board are provided to prevent cracks due to thermal stress by fixing a gap between a semiconductor chip and the printed board with under fill. CONSTITUTION: A solder bump(39) is printed on the surface of a printed board(33) using a solder ball printer. The solder bump is fixed on the surface by a reflow process. The printed board is mounted on a table. A protrusion(40) is formed on the peripheral part of a film(30). The protrusion prevents a semiconductor chip(41) from moving when the printed board with the semiconductor chip is moved.</p> |
| 申请公布号 |
KR20120108938(A) |
申请公布日期 |
2012.10.05 |
| 申请号 |
KR20120025014 |
申请日期 |
2012.03.12 |
| 申请人 |
HITACHI PLANT TECHNOLOGIES, LTD. |
发明人 |
MUKAI NORIAKI;MITSUMOTO MASARU;HOMMA MAKOTO |
| 分类号 |
H05K3/28;H05K3/34 |
主分类号 |
H05K3/28 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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