| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a silicone heat dissipation member maintaining thermal conductivity characteristics for a long time under high-humidity/temperature, having low elasticity, an excellent tracking property to substrate and adhesion. <P>SOLUTION: The silicone heat dissipation member is obtained by hardening a silicone resin composition comprising (a) an organopolysiloxane having at least two C-C double bonds reacting with SiH group in a molecule, (b) an organohydrogenpolysiloxane having at least two SiH groups in a molecule, (c) an addition reaction catalyst, (d1) alumina with an average particle size of 1-10 μm, (d2) alumina with an average particle size of 10-25 μm, and (d3) alumina with an average particle size of 30-70 μm. <P>COPYRIGHT: (C)2013,JPO&INPIT |
