发明名称 SUBSTRATE PROCESSING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To prevent breakage due to an earthquake and the like. <P>SOLUTION: A substrate processing device has a heat insulation cylinder 218 supporting a boat 217. The heat insulation cylinder 218 comprises an upper cylinder 10 fastened under the boat 217, and a lower cylinder 20 fastened under the upper cylinder 10. The upper cylinder 10 is formed into a cylindrical shape made of silicon carbide and having a diameter same as those of the boat 217, and is fastened to a lower end plate 217a of the boat by a silicon carbide bolt 18. The lower cylinder 20 is made of quartz and formed into a cylindrical shape with the same diameter as that of the upper cylinder 10, and externally coupled on the upper cylinder 10 and fastened by bolts 26. The bolt 26 is formed of quartz, and has a screw part 27 at a base end and a contact part 28 without a screw part at a tip. The screw parts 27 of the bolts 26 are screwed in screw holes 25 of stationary pieces 24 projecting at equal intervals on the lower cylinder 20, and the contact parts 28 are brought into contact with inner peripheries of heat passage holes 13 on a side wall 11 of the upper cylinder 10. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012216703(A) 申请公布日期 2012.11.08
申请号 JP20110081598 申请日期 2011.04.01
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 YOSHIOKA KAZUMA;KAGAYA TORU
分类号 H01L21/31;C23C16/458;H01L21/22;H01L21/324;H01L21/683 主分类号 H01L21/31
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