| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a power module package which can enhance reliability and performance of a module, maximize heat radiation effect, improve productivity, and reduce waste at the time of occurrence of defects. <P>SOLUTION: A power module package 500 includes: a first substrate 110 having one surface and the other surface; first vias 120, 130 formed to penetrate from one surface of the first substrate 110 to the other surface thereof; a metal layer 140 formed on one surface of the first substrate 110; semiconductor devices 150, 170, 180 formed on the metal layer 140; and a metal plate 400 formed on the other surface of the first substrate 110. <P>COPYRIGHT: (C)2013,JPO&INPIT |
