| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a film forming method capable of forming a film at a high coating speed, and a film forming device. <P>SOLUTION: The film forming method includes: a process for placing a substrate on a stage; a process for forming a meniscus of ink between an applicator and the substrate, the applicator being disposed maintaining a constant gap to the stage, being horizontally movable relatively to the stage, and being supplied with ink that contains a film formation material on its surface; a process for applying a voltage between the substrate and the applicator with the meniscus formed; and a process for forming the ink film on the substrate by relatively moving the applicator to the stage with the meniscus formed and the voltage applied. <P>COPYRIGHT: (C)2013,JPO&INPIT |
