| 摘要 |
A surface mount circuit protection device (10) includes a laminar PTC resistive element (12) having first and second major surfaces and a thickness (t) therebetween. A first electrode layer (14) substantially coextensive with the first surface is formed of a first metal material of a type adapted to be soldered to a printed circuit substrate. A second electrode layer (16) formed at the second major surface includes a structure forming or defining a weld plate (18). The metal weld plate (18) has a thermal mass and thickness (t w ) capable of withstanding resistance to micro-spot welding of a strap interconnect without significant resultant damage to the device. The device (10) is preferably surface mounted to a printed circuit board assembly forming a battery protection circuit connected to a battery/cell by battery strap interconnects, wherein one of the battery strap interconnects is micro spot welded to the weld plate of the device. |
