发明名称 PRINTED WIRING BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a printed wiring board having high reliability in prevention of forgery. <P>SOLUTION: The printed wiring board according to the present invention includes: first and second insulating layers facing each other; a first conductor pattern interposed between the first and second insulating layers; and an insulating printed layer which is interposed between the first and second insulating layers, contains a phosphor for absorbing light having a first wavelength to emit light of a second wavelength different from the first wavelength, and is at least partially positioned between the second insulating layer and the first conductor pattern. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013077763(A) 申请公布日期 2013.04.25
申请号 JP20110217850 申请日期 2011.09.30
申请人 TOPPAN PRINTING CO LTD;NEC TOPPAN CIRCUIT SOLUTIONS INC 发明人
分类号 H05K3/46;H05K1/02 主分类号 H05K3/46
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