| 发明名称 |
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a printed circuit board and a method of manufacturing the printed circuit board. <P>SOLUTION: The printed circuit board comprises: a base substrate; an inner layer insulating layer formed on top of the base substrate; an inner layer circuit layer formed on top of the inner layer insulating layer; an inner layer circuit protection layer formed on top of the inner layer circuit layer; an outer layer insulating layer formed on top of the inner layer circuit layer; and an outer layer circuit layer formed on top of the outer layer insulating layer. <P>COPYRIGHT: (C)2013,JPO&INPIT |
| 申请公布号 |
JP2013106029(A) |
申请公布日期 |
2013.05.30 |
| 申请号 |
JP20120005902 |
申请日期 |
2012.01.16 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
KYOUNG JUNG SOO |
| 分类号 |
H05K3/38;H05K3/24;H05K3/46 |
主分类号 |
H05K3/38 |
| 代理机构 |
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代理人 |
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