发明名称 WATER-INSOLUBLE LIGNIN AND THERMOSETTING RESIN MOLDING MATERIAL CONTAINING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a water-insoluble lignin; and to provide a molded product excellent in heat resistance, mechanical strength, coefficient of linear expansion, electrical insulating properties, and water resistance. <P>SOLUTION: A water-insoluble lignin of 230 &mu;m or lower (excluding 0 &mu;m) is obtained by pulverizing a lignin that is mainly of an H type. A molded product excellent in heat resistance, mechanical strength, coefficient of linear expansion, electrical insulating properties, and water resistance is obtained from the water-insoluble lignin and a thermosetting resin. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013116995(A) 申请公布日期 2013.06.13
申请号 JP20110266077 申请日期 2011.12.05
申请人 HARIMA CHEMICALS INC;OSAKA MUNICIPAL TECHNICAL RESEARCH INSTITUTE 发明人 OOGI TAKESHI;KIMURA HAJIME;MATSUMOTO AKIHIRO;OTSUKA KEIKO
分类号 C08H7/00;C08L97/00;C08L101/00 主分类号 C08H7/00
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