| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a prepreg including an insulative resin composition impregnated into a porous material support medium, and to provide a printed circuit board including the prepreg as an insulating layer. <P>SOLUTION: According to the invention, the porous support medium used for impregnating with the insulative resin composition has excellent heat stability, a wide surface area, and a thermal expansion coefficient unchanged by directional character. Since the prepreg has such a structure that the filler included in the insulative resin composition is dispersed between plural porous support media, the thermal expansion coefficient of the support medium is effciently improved. Further, even if the prepreg is damaged from outside, the damage is not enlarged but caused locally as a result of adjacent porous support media. Furthermore, the prepreg has excellent property against compressive load because of its porous structure, and thus enables reduction of damage in the printed circuit board. <P>COPYRIGHT: (C)2013,JPO&INPIT |
