| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic component package where a take-out number from a wafer can be increased, and electrodes of electronic components can be easily and electrically connected. <P>SOLUTION: An electronic component package 1 comprises: an electronic component 4 where electrodes are formed; and a casing 9 formed by joining a plurality of structural components so as to cover the electronic component. Electrical wiring, for leading the electrodes formed in the electronic component 4 to an outside of the package 1, is formed in the casing 9. <P>COPYRIGHT: (C)2013,JPO&INPIT |
