| 摘要 |
PROBLEM TO BE SOLVED: To provide an insulating/heat dissipating substrate for a power module, which can suppress increase in contact thermal resistance between a metal layer, which is used as a circuit layer, a heat diffusion layer, and so on, and a high thermal conducting insulation particle.SOLUTION: An insulating/heat dissipating substrate P for a power module, which conducts heat from a semiconductor chip mounted on one surface side to a cooler installed on the other surface side, comprises at least: an insulating resin substrate 1 having a high thermal conducting insulation particle 4 at a part corresponding to a mounting area of the semiconductor chip; a thin conductor layer 7 stacked on front/back surfaces of the insulating resin substrate; and a thick conductor layer 8 stacked on the front/back surfaces via the thin conductor layer 7. The front surface of the insulating resin substrate positioned on the mounting area of the semiconductor chip and a surface of the high thermal conducting insulation particle exposed from the insulating resin substrate are formed flush with each other, and a thickness of the insulating resin substrate positioned on a non-mounting area of the semiconductor chip is formed so as to be thinner that of the insulating resin substrate positioned on the mounting area. |
