发明名称 COOLER AND HEAT DISSIPATION PLATE
摘要 PROBLEM TO BE SOLVED: To provide a cooler which can limit an increase in pressure loss of refrigerant, and to provide a heat dissipation plate.SOLUTION: A cooler includes a heat dissipation unit 20 constituted by laminating four heat dissipation plates 30, 40, 50, 60, and a pair of cover plates disposed so as to hold the heat dissipation unit 20 from the lamination direction thus covering the open part of a groove in the lamination direction (Z axis direction). A groove 61a through which a refrigerant flows, and a partition 62a are formed in the heat dissipation plate 60. Similarly, grooves 31a, 41a, 51a and partitions 32a, 42a, 52a are formed in the heat dissipation plates 30, 40, 50. The grooves 31a, 41a, 51a, 61a are formed at positions overlapping the groove of other adjoining heat dissipation plate in the lamination direction, and the partitions 32a, 42a, 52a, 62a are formed at positions not overlapping the partition of other adjoining heat dissipation plate in the lamination direction.
申请公布号 JP2013175532(A) 申请公布日期 2013.09.05
申请号 JP20120038233 申请日期 2012.02.24
申请人 MITSUBISHI ELECTRIC CORP 发明人 KIKUCHI YOSUKE;HASHIMO SEIJI
分类号 H01L23/473 主分类号 H01L23/473
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