| 摘要 |
PROBLEM TO BE SOLVED: To provide a compact size semiconductor laser device which can inhibit an occurrence of dust.SOLUTION: A semiconductor laser device comprises a semiconductor laser chip 2, a sub-mount 3 and a resin 6. A thickness of the resin 6 is 0.1 mm and under. The resin 6 covers at least one among a place of the semiconductor laser chip 2 where a scribe line 12 is formed and a cut plane 15 of the sub-mount 3 for performing dicing. |
