发明名称 CUSTOMIZABLE THERMAL CONTROL
摘要 An apparatus, system, and method are disclosed for providing customized thermal control data structures. The default thermal control data structure is typically stored in a first storage device of the IOS module of the information processing system. A custom thermal control data structure is stored on a second storage device that is separately updatable from the first storage device. The thermal cooling module that provides cooling for the information processing system is directed to use the custom thermal control data structure for cooling components of the information processing system.
申请公布号 US2013258574(A1) 申请公布日期 2013.10.03
申请号 US201213436413 申请日期 2012.03.30
申请人 PAMLEY MARC RICHARD;ALI OMAR ALI;CHAPMAN CORY ALLEN;FARROW TIMOTHY SAMUEL;KEOWN, JR. WILLIAM FRED;MAKLEY ALBERT VINCENT;PFALTZGRAFF JAMES A.;LENOVO (SINGAPORE) PTE, LTD. 发明人 PAMLEY MARC RICHARD;ALI OMAR ALI;CHAPMAN CORY ALLEN;FARROW TIMOTHY SAMUEL;KEOWN, JR. WILLIAM FRED;MAKLEY ALBERT VINCENT;PFALTZGRAFF JAMES A.
分类号 H05K7/20 主分类号 H05K7/20
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