ACTIVE DEVICE ASSEMBLY

摘要

Active device assembly comprising a substrate having at least a planar surfa ce on which a plurality of electrical contact pads are formed, a chip having a surface on which at least one optical waveguide and a plurality of electrode s are formed. Said chip surface is in a facing relationship with the planar surface of the substrate, and said electrical contact pads are in electrical contact to said electrodes. Said contact pads and said electrodes provide mechanical connection between said chip and said substrate and the coefficie nt of thermal expansion of the substrate is greater than or equal to the coefficient of thermal expansion of the chip in a length direction.