发明名称 Method to fabricate a closed cell trench power MOSFET structure
摘要 A closed cell trench MOSFET structure having a drain region of a first conductivity type, a body of a second conductivity type, a trenched gate, and a plurality of source regions of the first conductivity type is provided. The body is located on the drain region. The trenched gate is located in the body and has at least two stripe portions and a cross portion. A bottom of the stripe portions is located in the drain region and a bottom of the cross portion is in the body. The source regions are located in the body and at least adjacent to the stripe region of the trenched gate.
申请公布号 US8569134(B2) 申请公布日期 2013.10.29
申请号 US201213567585 申请日期 2012.08.06
申请人 HSU HSIU WEN;GREAT POWER SEMICONDUCTOR CORP. 发明人 HSU HSIU WEN
分类号 H01L21/336 主分类号 H01L21/336
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