| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which firmly connects an electrode of a semiconductor element and a semiconductor element connection pad and achieves good electric insulation between neighboring semiconductor element connection pads.SOLUTION: A wiring board 10 comprises: an insulation substrate 1 having a mounting part 1a of a semiconductor element S; a plurality of strip-shaped wiring conductors 4 which are arranged on a top face of the insulation substrate 1 in parallel with each other so as to extend in a direction orthogonal to an outer periphery of the semiconductor element S; semiconductor element connection pads 5 each provided on each of the strip-shaped wiring conductors 4 and each composed of a conductor layer which is formed with a width the same with that of the strip-shaped wiring conductor 4 and in a shape of a projection; and a solder resist layer 3 having slit-like openings 3a for exposing the semiconductor element connection pads 5, respectively. The semiconductor element connection pad 5 includes a first conductor layer 7 which is deposited on the strip-shaped element wiring conductor 4 so as to expose lateral faces and has poor wettability, and a second conductor layer 8 which is deposited on the first conductor layer 7 and has excellent wettability. |
