| 摘要 |
A probe card for use in testing wafers for semiconductor devices is provided. In the probe card, a region having a plurality of probes corresponding to respective chips is divided into a plurality of subregions. A tester signal is switched between a pair of subregions thus divided so that the tester signal is supplied to one of the pair of subregions. The object to be measured by the probe card is switched according to chip arrangement on the semiconductor wafer by the switching of the tester signal, whereby useless parts in the periphery of the wafer are eliminated and the measurement efficiency is improved. |
