| 摘要 |
PROBLEM TO BE SOLVED: To move a bonding head with high accuracy by reducing the weight of a bonding head.SOLUTION: A bonding device 3 includes light guide means 7 for guiding laser light L from a laser oscillator 6, a bonding head 8 for heating a chip 1 with laser light, and bonding head moving means 9 for moving the bonding head between a supply position and a bonding position. The laser oscillator is provided separately from the bonding head, and the light guide means includes an irradiation barrel 22 provided in the vicinity of the bonding position, shutter means 23 provided in the irradiation barrel 22, and a light-receiving part 24 provided in the bonding head, and guiding the laser light to the chip. When the bonding head moving means locates the bonding head at the bonding position, the shutter means opens and the laser light from the irradiation barrel is guided in the bonding head 8 via the light-receiving part. |
