发明名称 |
ELECTROLYTIC TREATMENT METHOD AND ELECTROLYTIC TREATMENT APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To effectively and properly perform prescribed treatment to a workpiece, using object ions in a treatment liquid.SOLUTION: A direct electrode 20 and a counter electrode 22 are arranged so that a plating liquid M is sandwiched. An indirect electrode 21 forming an electric field in the plating liquid M is inextricably arranged to the direct electrode 20. By continuously applying a DC voltage between the indirect electrode 21 and the counter electrode 22, copper ions C in the plating liquid M are transferred to the side of the counter electrode 22. By applying a pulse voltage between the direct electrode 20 and the counter electrode 22, the copper ions C transferred to the side of the counter electrode 22 are reduced. |
申请公布号 |
JP2015004124(A) |
申请公布日期 |
2015.01.08 |
申请号 |
JP20140001465 |
申请日期 |
2014.01.08 |
申请人 |
KUMAMOTO UNIV ; TOKYO ELECTRON LTD |
发明人 |
AKIYAMA SHUSUKE ; IWAZU HARUO |
分类号 |
C25D21/00;C25D17/10;C25D21/12 |
主分类号 |
C25D21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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