发明名称 METHOD FOR FORMING CONDUCTING CIRCUIT
摘要 <p>PROBLEM TO BE SOLVED: To provide a method for forming a conducting circuit by which a printed circuit using silicone rubber as a print pattern structure-forming material is formed by a printing method, and good bondability with an electrode can be achieved simply and conveniently.SOLUTION: A method for forming a conducting circuit comprises the steps of: printing a circuit pattern-print layer having a predetermined pattern 1a onto a metal electrode 21 by use of a liquid addition-curable ink composition for conducting circuit drawing comprising (A) organopolysiloxane having at least two alkenyl groups bonded to a silicon atom, (B) organohydrogenpolysiloxane having at least two hydrogen atoms bonded to a silicon atom (SiH groups), (C) conductive particles, (D) a thixotropic agent selected from carbon black, zinc oxide, tin oxide, tin-antimony-based oxide and SiC, and (E) a hydrosilylation reaction catalyst, but including substantially no solvent; and baking and curing the liquid addition-curable ink composition to form the conducting circuit and in parallel, bond the conducting circuit with the metal electrode.</p>
申请公布号 JP2015005565(A) 申请公布日期 2015.01.08
申请号 JP20130128637 申请日期 2013.06.19
申请人 SHIN ETSU CHEM CO LTD 发明人 HAMADA YOSHITAKA
分类号 H05K3/36;H05K1/09;H05K3/12;H05K3/34 主分类号 H05K3/36
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