| 发明名称 |
CHIP-ON-FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME |
| 摘要 |
A chip-on-film package includes a base film including a bending area, an integrated circuit chip at an upper surface of the base film, a first line at the upper surface of the base film and overlapping the bending area, a second line at a lower surface of the base film and overlapping the bending area, a via pattern penetrating the base film to electrically couple the first line and the second line, and a common line coupled to the first line and to the integrated circuit chip, wherein at least a portion of the first line does not overlap at least a portion of the second line in a plan view. |
| 申请公布号 |
US2015028363(A1) |
申请公布日期 |
2015.01.29 |
| 申请号 |
US201414165491 |
申请日期 |
2014.01.27 |
| 申请人 |
Samsung Display Co., Ltd. |
发明人 |
Lee Hee Kwon |
| 分类号 |
H01L23/48;H01L23/14;H01L27/12;H01L27/15 |
主分类号 |
H01L23/48 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A chip-on-film package comprising:
a base film comprising a bending area; an integrated circuit chip at an upper surface of the base film; a first line at the upper surface of the base film and overlapping the bending area; a second line at a lower surface of the base film and overlapping the bending area; a via pattern penetrating the base film to electrically couple the first line and the second line; and a common line coupled to the first line and to the integrated circuit chip, wherein at least a portion of the first line does not overlap at least a portion of the second line in a plan view. |
| 地址 |
Yongin-City KR |
