| 摘要 |
PROBLEM TO BE SOLVED: To prevent reduction in heat dissipation efficiency of portions required to be cooled of a circuit formed on a substrate, prevent the portions required to be cooled from being heated by another heat source, and realize weight saving and improved versatility of a heat management structure of an electronic apparatus which includes a substrate having a principal surface on which an electronic component is mounted and a circuit is formed, and a heat dissipation member arranged on the principal surface of the substrate at intervals.SOLUTION: Provided is a heat management structure which includes: tubular resin filling cases 4, 5 extending from principal surfaces 1a and 1b of a substrate 1 to heat dissipation members 2 and 3; a heat dissipation resin 6 filling the resin filling cases; and tubular heat insulation members 7 and 8 which are provided so as to surround an outside of the resin filling case and extend from the principal surfaces of the substrate to the heat dissipation members. The resin filling cases are disposed so as to surround the portions 9 and 10, required to be cooled, formed on the substrate, and the heat dissipation resin fills first ends 21 and 31 of the resin filling cases located on the heat dissipation member side without any gap and contacting with second ends 22 and 32 of the resin filling cases located on the substrate side. |
