发明名称 |
CARRIER-FITTED COPPER FOIL, COPPER-CLAD LAMINATE, PRINTED WIRING BOARD, ELECTRONIC EQUIPMENT, AND METHOD FOR PRODUCING PRINTED WIRING BOARD |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a carrier-fitted copper foil having satisfactory etching properties.SOLUTION: Provided is a carrier-fitted copper foil including: a carrier; an intermediate layer; and an extra-thin copper layer in this order. The intermediate layer includes Ni, and when the carrier-fitted copper foil is heated at 220°C for 2 hr, and thereafter, in accordance with JIS C 6471, the extra-thin copper layer is peeled, the coating weight of Ni in the surface on the intermediate layer side is 400μg/dmor lower, the surface roughness Rz of the extra-thin copper layer measured using a touch needle type roughness gage in accordance with JIS B 0601-1982 being 0.2 to 1.5μm, and the standard deviation of the surface roughness Rz is 0.6μm or lower.</p> |
申请公布号 |
JP2015016688(A) |
申请公布日期 |
2015.01.29 |
申请号 |
JP20140122895 |
申请日期 |
2014.06.13 |
申请人 |
JX NIPPON MINING & METALS CORP |
发明人 |
NAGAURA YUTA;ISHII MASASHI |
分类号 |
B32B15/01;H05K1/09;H05K3/20 |
主分类号 |
B32B15/01 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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