Bump Pad Structure

摘要

An embodiment is a bump bond pad structure that comprises a substrate comprising a top layer, a reinforcement pad disposed on the top layer, an intermediate layer above the top layer, an intermediate connection pad disposed on the intermediate layer, an outer layer above the intermediate layer, and an under bump metal (UBM) connected to the intermediate connection pad through an opening in the outer layer. Further embodiments may comprise a via mechanically coupling the intermediate connection pad to the reinforcement pad. The via may comprise a feature selected from the group consisting of a solid via, a substantially ring-shaped via, or a five by five array of vias. Yet, a further embodiment may comprise a secondary reinforcement pad, and a second via mechanically coupling the reinforcement pad to the secondary reinforcement pad.

主权项

1. A method comprising:
etching a first dielectric layer to form a first recess; forming a first material in the first recess to form a reinforcement pad; forming a second dielectric layer over the first dielectric layer; etching a first opening through the second dielectric layer to the reinforcement pad; forming a second material in the first opening and on the second dielectric layer to form a first via and an intermediate connection pad; forming a passivation layer over the intermediate connection pad; forming an opening in the passivation layer to the intermediate connection pad; and forming an under bump metal (UBM) in the opening and partially on the passivation layer.