NON-LEADED TYPE SEMICONDUCTOR PACKAGE AND METHOD OF ASSEMBLING SAME

摘要

A no-lead type semiconductor package has a mold cap that forms a mold body. The corners of the mold body are reinforced with mold columns such that the corners have rounded protrusions and do not form 90° angles. The mold columns prevent the corner pads from peeling.

主权项

1. A semiconductor package, comprising:
a die flag having an upper surface and a lower surface; a semiconductor die attached on the upper surface of the die flag; a plurality of leads surrounding the die flag, wherein each of the leads has a top surface and a bottom surface opposite to the top surface, and the top surface is electrically connected with the semiconductor die with a bond wire; and a mold cap that covers the semiconductor die, bond wires, and at least a portion of each of the leads, wherein the mold cap comprises a generally rectangular mold body, and wherein the mold body has reinforced corners comprising mold columns that protrude from each of said corners.