| 发明名称 |
DEVICE FOR ATTACHING CHIP ON FILM ONTO PANEL AND METHOD FOR USING THE SAME |
| 摘要 |
The present disclosure relates to a device for attaching a chip on film onto a panel and the method of use the device. The device comprises a platform for conveying the panel, a pressure head for carrying the chip on film, and a panel supporting mechanism in cooperation with the pressure head during use. The device further comprises a distance-adjusting mechanism for measuring a distance between the panel and the supporting mechanism after the panel is placed between the pressure head and the supporting mechanism, and reducing the distance. According to the device of the present disclosure, the distance between the panel and the supporting mechanism can be reduced, so that the deflection occurred during attachment of the chip on film can be avoided. Therefore, the quality of the final product obtained can be improved. |
| 申请公布号 |
US2015026962(A1) |
申请公布日期 |
2015.01.29 |
| 申请号 |
US201414240369 |
申请日期 |
2014.01.28 |
| 申请人 |
Chen Fangfu |
发明人 |
Chen Fangfu |
| 分类号 |
G02F1/1333 |
主分类号 |
G02F1/1333 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A device for attaching a chip on film onto a panel, comprising a platform for conveying the panel, a pressure head for carrying the chip on film, and a panel supporting mechanism in cooperation with the pressure head during use,
wherein the device further comprises a distance-adjusting mechanism for measuring a distance between the panel and the supporting mechanism after the panel is placed between the pressure head and the supporting mechanism and reducing the distance. |
| 地址 |
Shenzhen CN |
