| 摘要 |
In manufacturing an electronic device in which a semiconductor chip (10), in which a device layer (11) has been formed on the surface of a substrate (1), and a heat sink (20), which radiates heat of the semiconductor chip (10), are connected via a heat spreader, a first heat spreader (2) is formed using first carbon nanotubes (14) on the rear face of the semiconductor chip (10), a second heat spreader (4) is formed using second carbon nanotubes (23) on the heat sink (20), and the first heat spreader (2) and the second heat spreader (4) are adhered together. By way of the configuration, an electronic device of high reliability which is of a relatively simple configuration, of extremely low thermal resistance, and which achieves efficient heat radiation is achieved. |
