| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipation structure of an electronic component by using a high heat dissipation substrate.SOLUTION: In order to achieve thermal connection of an electronic component 7, formed of a material having high thermal conductivity, such as a metal, and mounted on the surface of a high heat dissipation board 3 having a through hole and embedding a heat dissipation chip 1, and the heat dissipation chip 1, a heat transfer agent or a heat transfer adhesive 8 fills under the electronic component 7 from the back side of the board through a through hole of the heat dissipation chip 1. Alternatively, a heat dissipation screw 9 formed of a metallic material equivalent to that of the heat dissipation chip 1 is inserted from the back side of the board through a through screw hole 6 of the heat dissipation chip 1 so as to come into contact with the electronic component 7 (heating part). |
