PHOTOSENSITIVE RESIN COMPOSITION FOR PROJECTION EXPOSURE, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, PROCESS FOR PRODUCING PRINTED WIRING BOARD AND PROCESS FOR PRODUCING LEAD FRAME

摘要

The purpose of the present invention is to provide a photosensitive resin composition which is to be subjected to projection exposure and which can form a resist pattern that exhibits excellent adhesion and resolution and that suffers from little scumming at the bottom of the resist. The present invention provides a photosensitive resin composition which is to be subjected to projection exposure and which comprises (A) a binder polymer, (B) a photopolymerizable compound having an ethylenically unsaturated bond, (C) a photopolymerization initiator and (D) a sensitizing dye, wherein the photo- polymerizable compound (B) having an ethylenically unsaturated bond contains both an (meth)acrylate compound having a skeleton resulting from dipentaerythritol and a compound represented by general formula (III). In general formula (III), R8,R9,R10 andR11 are each independently a hydrogen atom or methyl, X and Y are each independently ethylene or propylene, and p1, p2, q1 and q2 are each independently a number of 0 to 9 and satisfy the relationships: p1 + q1 ≥ 1; p2 + q2 ≥ 1; and p1 + q1 + p2 + q2 = 2 to 9.