发明名称 SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF THE SAME, ELECTRONIC APPARATUS, AND MOBILE OBJECT
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device in which matching of electric characteristics is achieved between a circuit part and a wiring part.SOLUTION: A semiconductor device includes: a circuit part having a circuit electrode part; a re-wiring part laminated on the circuit part; and a re-wiring electrode part provided on a surface of the re-wiring part that is opposite to the circuit part. A signal wiring part which connects the circuit electrode part with the re-wiring electrode part and a matching wiring part connected with the circuit electrode part are provided in the re-wiring part.
申请公布号 JP2015018938(A) 申请公布日期 2015.01.29
申请号 JP20130145224 申请日期 2013.07.11
申请人 SEIKO EPSON CORP 发明人 KANEMOTO YOKO
分类号 H01L23/12;H01L21/3205;H01L21/768;H01L21/822;H01L23/522;H01L27/04 主分类号 H01L23/12
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