| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor sensor the frame of which is reduced by forming a part of a circuit in the dead space of a cap substrate, and to provide a manufacturing method therefor. <P>SOLUTION: In the semiconductor sensor where a sensor substrate 10 and a cap substrate 50 are bonded with an insulating film 51 interposed therebetween, the portion from a backside 50b of the cap substrate 50 to the insulating film 51 is removed, an insulating film 60 is formed on the wall surface of the cap substrate 50 exposed to the outside, a recess 56a having the insulating film 60 as the sidewall and the insulating film 51 exposed to the outside as a bottom is formed at the projection position to the backside 50b in internal wiring 13b of the sensor substrate 10, a capacitor C1 is formed by external wiring 53a and the internal wiring 13b on the recess 56a, and a resistor R1 is formed by the external wiring 53a between a through electrode 52a formed on the cap substrate 50 and the recess 56a. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
