| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an image sensor substrate which improves mounting accuracy of semiconductor substrates by resolving limitations caused by arrangement positions of alignment marks provided in the semiconductor substrate for alignment .SOLUTION: An image sensor substrate includes: a semiconductor substrate 1 having a terminal part 4 and a circuit wiring pattern 1d; a photoelectric conversion section 2 which photoelectrically converts light; a driving circuit section 3 which outputs from the terminal part 4 an electric signal which was output from the photoelectric conversion section 2; a plurality of optical filters 5 which are selectively arranged on the photoelectric conversion section 2, and transmit light of different optical wavelengths; a light reflecting pattern part 6 which is formed in a predetermined region by laminating the plurality of optical filters 5 on the driving circuit section 3, except a predetermined region of the circuit wiring pattern 1d of the semiconductor substrate 1 or an open pattern 1d thereof in a region of the driving circuit section 3; a sensor substrate 7 having the semiconductor substrate 1 mounted thereon; and reference marks 7a provided on the sensor substrate 7. The semiconductor substrate 1 and the sensor substrate 7 are aligned by means of clearances between the reference marks 7a and the light reflecting pattern parts 6.</p> |
