| 摘要 |
PROBLEM TO BE SOLVED: To mount a chip component at an intended position of a circuit board even when solder reflow process is performed at the time of mounting a small sized chip component.SOLUTION: The above-described problem is solved by improving a shape of a connection electrode (land) which is connected with a chip component by a solder. By differentiating an upper surface shape of the connection electrode from an upper surface shape of a terminal electrode, inclination of a lower surface of the chip component is reduced. Note that, an area of the connection electrode is preferable to be larger than an area of the terminal electrode of the chip component in a state where the chip component is stacked, and the upper shape of the connection electrode is preferable to have a part projecting outward from the terminal electrode. And, an overlapping area of the connection electrode with the terminal electrode is equivalent with the area of the terminal electrode and a whole area of the connection electrode is larger than the area of the terminal electrode. |
